A single system for grinding and polishing
Duetto has been designed to work with both soft interface and micro abrasives as well as buffers for polishing, ensuring first class performance in both modes.
Careful studies on the dynamics of the eccentric movement and in-depth practical tests have led to the choice of an eccentricity of 6 mm ( total oscillation circle 12 mm). The corrective capacity of the latest generation of micro-grinding wheels is greatly improved, especially when flattening irregularities or large surface defects, where a very good uniformity of the grinding trace depth is obtained.
The same eccentric movement also effectively and incredibly easily guides the polishing buffers to achieve a high level of finish very quickly.
The use of micro-grinding wheels to correct significant imperfections speeds up and facilitates the polishing cycle, as operations that would normally be difficult to perform in polishing mode alone are reduced to a matter of minutes. This operation requires machines with accurate balancing and optimal motion control. Minor changes can result in uneven roughness of the surface, requiring hard work in the subsequent machining stages. Duetto is easy to guide and immediately feels at ease with the operator.
In particular, one notices some attentions that contribute to obtain a good result, such as the antispinning device that reduces the possibility of errors even for operators less familiar with the machine, the frontal handle that facilitates the resting of the palm in the virtual centre of the eccentric mass and the electronic module with torque control.
The rubber tray allows the Duetto to be placed on the workbench and prevents contamination of the abrasive by dust that could get onto and damage the surface being worked on.
Weight Kg 2,6
Power W/hp 400
Ø Sanding stroke mm 12
Ø Velcro sanding disc mm 125